Layer Count / Technology

4 - 12 Layers

4 - 14 Layers

PCB Thickness Range

0,3- 1,2 mm

0,3 - 1,4 mm

Build up Technology

ANY LAYER Microvias copper filled

ANY LAYER Microvias copper filled

Min. Laser drill Diameter

110 µm

80 µm

Laser Technology

CO2 direct drilling (UV/CO2)

CO2 direct drilling (UV/CO2)

Materials

FR4 / FR4 halogen reduced

FR4 / FR4 halogen reduced

Glass Transition Temperature

105°C / 140°C / 170°C

105°C / 140°C / 170°C

Standard glass cloth

106 / 1080 / 2116 / 1501 / 7628

1037 / 106 / 1080 / 2116 / 1501 / 7628

Copper thickness

12 µm / 18µm

9µm / 12µm / 18µm

Copper Plating Holes

20 µm (25 µm)

13 µm / 20 µm / 25 µm

Min. Line / Spacing

75µm / 75µm

50µm / 50µm

Soldermask Registration

+/- 38 µm (Photoimageable)

+/- 25 µm (Photoimageable)

Min. Soldermask Dam

70 µm

60 µm

Soldermask Color

green / white / black / red / blue

green / white / black / red / blue

Max. PCB Size

575 mm x 500 mm

575 mm x 500 mm

Production Panel

609,6 mm x 530 mm
609,6 mm x 457,2 mm

609,6 mm x 530 mm
609,6 mm x 457,2 mm

Min. Annular Ring

125 µm

100 µm

smallest drill

0,28 mm

0,15 mm

smalles Routing bit

0,8 mm

0,8 mm

Surfaces

OSP / HAL Lead Free / Immersion Tin
Immersion NI/AU
Plated Ni/Au
Immersion Ag

OSP / HAL Lead Free / Immersion Tin
Immersion NI/AU
Plated Ni/Au
Immersion Ag

Scoring

Yes

Yes

ID print

White

White

Blue Mask & Carbon print

Yes

Yes